MICROSCOPE INCLUDING INTERFEROMETER

VALUE PROPOSITION

This technology lies in its ability to provide high-quality, 3D imaging of samples with significant surface offsets from a nominal plane, while maintaining spatial resolution. By employing a microscope with an interferometer and utilizing single-shot, polarization-sensitive detection this system offers advantages over conventional devices. These advantages include the elimination of vibration and drift, quick acquisition of interference patterns, and the ability to observe a variety of samples with ease. The use of phase-shifting interferometry ensures high-quality images, while the low-coherence light used minimizes speckles and interference not directly related to the sample.

DESCRIPTION OF TECHNOLOGY

This technology is a microscope system and method that utilizes an interferometer to provide high-quality, 3D imaging of samples with significant surface offsets from a nominal plane. The system employs a microscope with an interferometer, tilting a reference mirror and/or offsetting the sample from the centerline of an adjacent objective or telescope lens. A key feature of this system is the simultaneous detection of a fringe pattern with a phase-shift using light polarization in a single-shot. This approach utilizes an interferometer, with ability to eliminate vibration and drift, quick acquisition of interference patterns, and the ability to observe a variety of samples with ease. The system is particularly beneficial for measuring or imaging samples with complex surface shapes, such as steeply projecting pyramids, cylinders, or other polygons, and can achieve a spatial resolution of about 10 nm, with the potential to reach 0.3 nm with an atomically flat reference mirror.

BENEFITS

  • High-quality 3D imaging
  • Single-shot, polarization-sensitive detection
  • Elimination of speckles and interference
  • Minimized vibration and drift
  • Easy sample observation
  • Compatibility with short wavelength light

 

APPLICATIONS

  • Surface profiling
  • Thin film analysis
  • Microelectronics inspection
  • Material characterization
  • Biomedical research
  • Quality control

 

IP Status

US Patent Pending

LICENSING RIGHTS AVAILABLE

Full licensing rights available

Inventors: Marcos DANTUS and Sergei ANISHCHIK

Tech ID: TEC2022-0135

 

For more information about this technology,

Contact Jon Debling, Ph.D. at deblingj@msu.edu or +1-517-884-1653

 

 

Patent Information: