THE CHALLENGE
Companies developing wearable devices, soft robotic systems, and other flexible products face difficulties in finding reliable and scalable ways to connect rigid electronic components to flexible substrates. Traditional soldering overheats delicate polymers, and current conductive adhesives crack, lose conductivity, or fail to bond during repeated bending. Existing solutions also struggle to balance strong electrical performance with mechanical softness, making it difficult for manufacturers to produce durable products that meet consumer expectations. As demand grows for lightweight, bendable, and high performing electronics, the market urgently needs an interconnect material that offers high conductivity, strong adhesion, and true mechanical flexibility while fitting into low temperature and cost-efficient manufacturing processes.
OUR SOLUTION
Dr. Bartlett’s lab has developed an advanced electrically conductive adhesive designed to meet the growing demand for flexible and hybrid electronics in wearable devices, soft robotics, and next-generation consumer products. A soft, elastomeric matrix combined with microscopic liquid metal droplets coated by silver flakes creates a highly conductive network that delivers reliable electrical performance while remaining mechanically flexible and strongly adhesive. Unlike traditional soldering or conventional conductive adhesives, the resulting paste cures at low temperatures, protecting heat-sensitive substrates and eliminating the need for high-temperature processing or sintering. Its unique formulation also enhances durability under repeated bending and mechanical stress, ensuring long-lasting performance and reducing manufacturing failures. By providing a scalable, easy-to-process, and robust interconnect solution, this technology addresses a critical market need for reliable, flexible electronics while enabling manufacturers to produce innovative products with confidence.
Figure: Robust hybrid electronics demonstration showing LEDs on PET with E-CASE adhesive remaining functional under bending, weight loading, and extreme mechanical stress.
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