Search Results - artificial+intelligence+accelerators

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Render (Case No. 2026-154)
Summary: UCLA researchers have developed a minimally invasive surgery visualization system that uses integrated surgical access ports with built-in imaging and illumination, along with an AI-based virtual camera engine, to create an automatically instrument-centric view without requiring a dedicated laparoscope port. Background: Minimally invasive...
Published: 6/11/2026   |   Updated: 6/11/2026   |   Inventor(s): Peyman Benharash, Sara Sakowitz, Ryan Witt
Keywords(s): AI-guided medical imaging, Artifical Intelligence (Machine Learning, Data Mining), artificial electromagnetic materials, Artificial Intelligence, artificial intelligence accelerators, artificial intelligence algorithms, artificial intelligence augmentation, artificial intelligence/machine learning models, artificial intelligence-generated content, Artificial Neural Network, Artificial Neural Network Artificial Neuron, artificial presenting cells, artificial-intelligent materials, biomedical implantation, generative artificial intelligence, Medical artificial intelligence (AI), Medical Imaging, Medical Imaging Eyepiece
Category(s): Medical Devices, Medical Devices > Medical Imaging, Medical Devices > Surgical Tools, Medical Devices > Monitoring And Recording Systems, Software & Algorithms, Software & Algorithms > Artificial Intelligence & Machine Learning, Software & Algorithms > AI Algorithms, Software & Algorithms > Image Processing
Accurate Compute-In-Memory Accelerator With Multi-Level Analog Weight Storage (Case No. 2026-169)
Summary: UCLA researchers in the Department of Electrical and Computer Engineering have developed a high-density, multi-level CTT-based compute-in-memory architecture that enables precise, energy-efficient analog computation directly within memory for high-performance computing. Background: Conventional digital processors for artificial intelligence...
Published: 6/15/2026   |   Updated: 6/3/2026   |   Inventor(s): Sudhakar Pamarti, Mohammadreza Zeinali, Samyak Chakrabarty, Vinod Kurian Jacob
Keywords(s): Advanced Computing / AI, advanced computing methods, AI, AI hardware, analog computing, Artificial Intelligence, artificial intelligence accelerators, Artificial Neural Network, CMOS, compute-in-memory, edge computing, Energy Efficiency, high-performance computing, Memory, parallel computing, Transistor, transistors
Category(s): Software & Algorithms > Artificial Intelligence & Machine Learning, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Electrical > Electronics & Semiconductors > Circuits, Electrical > Electronics & Semiconductors > Memory
Design of High Thermal Conductivity Through-Glass Vias (TGVS) Interposers (Case No. 2026-157)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel method for producing electrically insulating, high–thermal conductivity through-glass vias. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced form...
Published: 3/5/2026   |   Updated: 2/20/2026   |   Inventor(s): Tiwei Wei
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, Composite Material, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, Functional Materials, functional/composite materials, glass interposers, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, through-glass vias (TGVs)
Category(s): Materials, Materials > Composite Materials, Materials > Functional Materials, Materials > Semiconducting Materials, Materials > Metals, Materials > Nanotechnology, Electrical, Electrical > Electronics & Semiconductors
Through-Glass Vias (TGVS) Thermal Management for Advanced 3DIC Packaging (Case No. 2026-156)
Summary: UCLA researchers in the Department of Mechanical and Aerospace Engineering have developed a novel approach to enhance the thermal performance of through-glass vias for advanced semiconductor packaging. Background: Advanced semiconductor systems rely on 3D integrated circuits (3DICs) to meet rising demands for higher performance, reduced...
Published: 3/5/2026   |   Updated: 2/20/2026   |   Inventor(s): Tiwei Wei, Ye Yang
Keywords(s): 3D integrated circuits (3DIC), advanced semiconductor packaging, artificial intelligence accelerators, copper electroplating, cubic-octahedral diamond, diamond composites, diamond metallization, Doping (Semiconductor), Electronics & Semiconductors, ferromagnetic semiconductor, functional/composite materials, glass interposers, heat dissipation, high-performance computing, Microelectronics Semiconductor Device Fabrication, microfabrication, Organic Semiconductor, physical vapor deposition (PVD), real-time thermal management, Semiconductor, semiconductor chip foundries, Semiconductor Device, Semiconductor Device Fabrication, Semiconductor Ohmic Contact, Semiconductor Risk Assessment, Semiconductor Sapphire, Semiconductors, silicon interposers, thermal bottleneck, thermal management, thermal management systems, through-glass vias (TGVs), zzsemiconducting materials
Category(s): Chemical, Chemical > Industrial & Bulk Chemicals, Chemical > Synthesis, Chemical > Chemical Processing & Manufacturing, Electrical, Electrical > Computing Hardware, Electrical > Electronics & Semiconductors, Materials, Materials > Metals, Materials > Semiconducting Materials, Materials > Functional Materials, Materials > Fabrication Technologies, Materials > Composite Materials, Software & Algorithms > Communication & Networking